| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 1.6mm / 0.8mm / 2.0mm / Custom;
Custom: OEM / ODM;
Copper: 1oz/35um, 2oz / 70um;
Legend: White;
Surface Finish: L-F HASL / Enig;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 0.21--7mm;
Min. Hole Size: 0.10mm;
Min. Line Width: 3mil;
Min. Line Spacing: 3mil;
Surface Finishing: HASL;
Soldermask: Green,Yellow,Black,White,Red;
Silkscreen: White,Yellow,Black;
Special Technological Requirement: Blind & Buried Vias and High Thickness Copper;
Needed: Gerber File,Bom List,Sample If Better;
Board Copy Service: Yes;
PCB Factory: Yes;
|