| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 0.21--7mm;
Min. Hole Size: 0.10mm;
Min. Line Width: 3mil;
Min. Line Spacing: 3mil;
Surface Finishing: HASL;
Soldermask: Green,Yellow,Black,White,Red;
Silkscreen: White,Yellow,Black;
Special Technological Requirement: Blind & Buried Vias and High Thickness Copper;
Needed: Gerber File,Bom List,Sample If Better;
Board Copy Service: Yes;
PCB Factory: Yes;
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Metal Coating: Tin;
Mode of Production: DIP;
Customized: Non-Customized;
Condition: New;
Storage Temperature: -50c to +85 C;
Operating Temperature: -40 C to +70 C;
Relative Humidity: 0 to 95% Non-Condensing at +36c;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-24 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: SIC;
Customized: Non-Customized;
Condition: New;
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