| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Yuwei;
Product Name: 2 Layer PCB;
Keywords: Rigid / Flex / Rigid-Fle;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-50 L;
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Type: Flame Retardant 4 PCBA;
Dielectric: FR-4;
Material: Flame Retardant;
Flame Retardant Properties: UL94 V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: AC42228-Sh001-B1 Smart PCBA Module;
Brand: Weforsemi;
Testing Service: Electrical Testing,Flying Probe Tester,Functiona;
Condition: New;
Custom Condition: Support;
Function1: Digital Tube Display, LED Display, Button Control,;
Function2: MCU Power Supply, Buzzer and Relay;
Type1: Power Board;
Type2: Control Board;
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Type: Flame Retardant 4 PCBA;
Dielectric: FR-4;
Material: Flame Retardant;
Flame Retardant Properties: UL94 V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: Vc100ga-V1.0 M3 Module PCBA;
Brand: Weforsemi;
Testing Service: Electrical Testing,Flying Probe Tester,Functiona;
Condition: New;
Custom Condition: Support;
PA2: Burningio Mouth;
Vcc: Power Input 2-*5.5V;
Standby Operating Current: 13-15mA;
Warranty: 12 Months;
Shipping: Air or Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
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