| Specification |
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fr4 + Polyimide;
Application: Smart Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polyimide;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Keywords: Rigid;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-50 L;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
MOQ: 1 Piece;
Assembly Type: SMT;
Layers: 2;
PCBA-Testing: X-ray, Aoi;
Silkscreen Color: Black;
Solder Mask Color: White;
Copper Thickness / Board Thickness: 1oz;
Surface Finishing: HASL;
Customization: Customized;
Fine Pitch BGA: Support;
Certifications: ISO9001/RoHS;
Metal Layer: Copper;
Min Hole Size: 0.2mm;
Product Type: PCBA;
Min Line Width: 0.1mm;
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Type: Multilayer PCB;
Dielectric: Fr-4 / High-Tg Fr-4;
Application: Consumer Electronics / Industrial Control / Lot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid /Flex /Rigid-Fle;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Organic Resin;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Customization: Customized;
MOQ: 1 Piece;
Industrial Control;
Copper Foil Type: Electrolytic Copper Foil;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Conformal Coating: Optional;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Technical Service: Dfm Review, Technical Support;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Compliance Standard: Ipc a 610 Class 2 or Class 3;
Flame Retardant Grade: V0;
Number of Layers: 1 to 20 Layers;
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