| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Okey;
Color: Green, Blue, Black, Red, Yellow etc.;
Surface Finish: Lead Free HASL;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
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Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Material: Fr-4, Cem-1/Cem-3, Pi, High Tg, Rogers;
Board Layer: 4L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq, etc.;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Application: All Kinds of Industries;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: HASL/HASL (Lf)/ OSP/Immersion Gold/Enig/Goldfinger;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Layer: 1-20;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Red/Blue/White/Black/Yellow/ etc;
Surface Finish: HASL/HASL Lead Free/OSP/Immersion Gold/Tin/ Silv;
Min Hole Size: 0.2mm;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Packing: Vacuum Package;
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