| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
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Structure: Fr4, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Polyester Glass Fiber Mat Laminate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Conductive Adhesive: Conductive Silver Paste;
Combination Mode: SMT&DIP;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Board Material: Aluminum;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 2 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Test: Fly Probe Testing;
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