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PCBA
US$1.12-1.63 / Piece
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What is OEM and ODM Electronics Multilayer Printed Circuit Board PCB and PCBA Manufacturer

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.12-1.63 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Mustar
  • Transport Package ESD Bag, Bubble Pack
  • Specification standard
  • Trademark Mustar
  • Origin China
  • Certificate ISO9001/RoHS/ISO14001/ISO13485/Ts16949
  • Testing Service Aoi,X-ray,Function Test
  • Color Yellow Blue Green Black White
  • Service 24 Hours Technical Services

Product Description

Oem And Odm Electronics Multilayer Printed Circuit Board PCB And PCBA Manufacturer Product parameters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm ...

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PCBA Comparison
Transaction Info
Price US$1.12-1.63 / Piece US$2.06-6.00 / Piece US$0.98-5.00 / Piece US$1.10-1.30 / Piece US$0.80-13.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 1 Piece 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, PayPal, Western Union T/T
Quality Control
Product Certification ISO9001/RoHS/ISO14001/ISO13485/Ts16949 RoHS, CCC, ISO RoHS, CCC, ISO - RoHS, CCC, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 - ISO9001:2015
Trade Capacity
Export Markets North America Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Mustar;
Testing Service: Aoi,X-ray,Function Test;
Color: Yellow Blue Green Black White;
Service: 24 Hours Technical Services;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer Count: 4layer;
Board Thickness: 1.6mm;
Board Material: Fr4;
Surface Finish: Enig/1u'';
Soldermask Color: Black;
Cooper Thickness: 1oz;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier