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PCB Assembly
US$0.98-5.00 / Piece
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What is Multi-Layer PCBA Board PCB Assembly Service with CE RoHS UL

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.09

5,000+ Pieces US$0.98

Sepcifications

  • Type Customized
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Customized
  • Processing Technology Customized
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand OEM/ODM
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin Shenzhen China
  • PCBA-Testing X-ray, Aoi
  • Processing Electrolytic Foil
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Certification RoHS, CCC, ISO
  • Min. Space of BGA +/- 0.3mm
  • Min.Pin Space of IC 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • Surface Finishing Lead-Free HASL
  • Number of Layers 4-10 Layer
  • Board Thickness 1.6mm

Product Description

Multi-layer PCBA Board PCB Assembly Service with CE RoHS UL Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and PCBA assembly drawing. Test ...

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PCB Assembly Comparison
Transaction Info
Price US$0.98-5.00 / Piece US$0.90-2.60 / Piece US$2.00-2.80 / PCS US$1.00-10.00 / Piece US$0.85-1.33 / PCS
Min Order 10 Pieces 1 Piece 1 PCS 1 Piece 1 PCS
Payment Terms T/T LC, T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union LC, T/T LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification RoHS, CCC, ISO - UL,ISO 9001,ISO14001,IATF16949 - ISO,UL,RoHS
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM - Own Brand, ODM -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Immersional Gold;
Brand: UC;
Board Layer: 1L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCBA: PCBA;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

JS Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier