| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Fr;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape: Rectangular, Round, Slots, Cutouts, COM;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch* 22inch or 550mm* 550mm;
Min.Drilled Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 1/20z, 10z, 20z, 30z;
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Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Uc;
Layers: 1/2;
Base Material Type: Aluminum;
Material Finished Thickness: 1.6mm;
Finished Copper Thickness: 1/2 Oz;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Solder Mask Color: White;
Screen Color: Black;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 5+ Working Days;
Ipc Standards: Ipc Class II;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Base Material Type: Fr4;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1 Oz;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red...;
Screen Color: White/Black/ Red...;
Special: Impedance Control;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 5 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Finished Copper Thickness: 1&2 Oz;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 5 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Base Material Type: Fr4;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1 Oz;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red...;
Screen Color: White/Black/ Red...;
Special: Impedance Control;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 8 Working Days;
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