| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2, HB;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
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