| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: No;
Brand: Exceeding;
Technology: Lead The Industry;
Surface Finish: Immersion Ni/Au;
Keyword: FPC;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.2mm (8 Mil);
Board Thickness: 0.2mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl,Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl,Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl,Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
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