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FPC
US$0.50-5.00 / pieces
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What is Smart Electronics FPC Motherboard Design and Manufacture Flexible Printed Circuit - FPC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-999 pieces US$5.00

1,000+ pieces US$0.50

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Base Material Pl,Copper and Ni/Au
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification Customized
  • Trademark Smart
  • Origin Guangdong, China
  • Supplier Type Manufacturer
  • Copper Thickness 0.5oz
  • Min. Hole Size 0.15mm
  • Min. Line Spacing 0.075mm
  • Min.Line Width 0.075mm
  • Board Thickness 0.057 to 0.6mm
  • Surface Finishing Enig, Immersion Silver, OSP
  • Stiffener Without, Top, Bot, Both Sides
  • Solder Mask(Coverlay) Yellow, White, Black

Product Description

Serial Number Item Process Capability Tolerance 01 Number of layers 1-16 MAX:500X3000MM 02 Production plate size MAX:250X3000MM 0.08MM 03 Drilled Hole Diameter MIN:250X1500MM 0.03MM 04 Tolerance of drilled hole diameter 6.5MM/0.1MM 15-40UM 05 Copper thickness in hole ...

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FPC Comparison
Transaction Info
Price US$0.50-5.00 / pieces US$0.10-0.50 / Piece US$0.10-0.50 / Piece US$0.10-0.50 / Piece US$0.10-0.50 / Piece
Min Order 5 pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union T/T, LC, D/P, PayPal, Western Union T/T, LC, D/P, PayPal, Western Union T/T, LC, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl,Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Board Material Option: Flame Retardant;
Environmental Certification: RoHS Compliant;
Forming Method: Mechanical Forming/Film Punching Forming;
Testing Method: Aoi Full Inspection + Flying Probe Sampling Inspec;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Board Material Option: Flame Retardant;
Environmental Certification: RoHS Compliant;
Forming Method: Mechanical Forming/Film Punching Forming;
Testing Method: Aoi Full Inspection + Flying Probe Sampling Inspec;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Board Material Option: Flame Retardant;
Environmental Certification: RoHS Compliant;
Forming Method: Mechanical Forming/Film Punching Forming;
Testing Method: Aoi Full Inspection + Flying Probe Sampling Inspec;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Board Material Option: Flame Retardant;
Environmental Certification: RoHS Compliant;
Forming Method: Mechanical Forming/Film Punching Forming;
Testing Method: Aoi Full Inspection + Flying Probe Sampling Inspec;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Dongguan Bohaiming Electronics Co., Ltd.

Diamond Member Audited Supplier

Dongguan Bohaiming Electronics Co., Ltd.

Diamond Member Audited Supplier

Dongguan Bohaiming Electronics Co., Ltd.

Diamond Member Audited Supplier

Dongguan Bohaiming Electronics Co., Ltd.

Diamond Member Audited Supplier