| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Outline: Module Punch;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED Strip;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide or Polyester;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Soldermask: Coverlay, Film, Paint;
Substrate: Pi, Pet;
Copper: 35/35um, 35/70um, 1/1oz, 1/2oz;
Surface Finish: OSP;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED Strip;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide or Polyester;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Soldermask: White Coverlay Film;
Copper: 1/1oz, 1/2oz, 35/35um, 35/70um;
Thickness: 0.2mm, 0.3mm;
Packing: Roll or Panel;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED Strip;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide or Polyester;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Soldermask: White Coverlay, Film, Paint;
Substrate: Pi, Pet;
Thickness: 0.2mm, 0.3mm;
Packing: Reel to Reel, Panel to Panel;
|
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED Strip;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide or Polyester;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Soldermask: White Coverlay, Film;
Copper: 1/1oz, 1/2oz;
Surface Finish: OSP;
Substrate: Pi;
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