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Flex PCB
US$0.01-0.10 / Piece
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What is OEM Fast Prototype Double Side Fold Semi Bare FPC Flex PCB PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$0.10

100-999,999 Pieces US$0.05

1,000,000+ Pieces US$0.01

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Packing
  • Specification 100*100
  • Trademark Abis
  • Origin China
  • Tg Tg130-Tg180
  • Inner Copper 1 Oz
  • Finish Copper 2 Oz
  • Solder Mask Green
  • Silk White
  • Surface Finish HASL

Product Description

ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, Multilayer and HDI pcb mass production 3. Two factories, one for small and middle volume orders, another for big volume and HDI Keywords ...

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Flex PCB Comparison
Transaction Info
Price US$0.01-0.10 / Piece US$1.00 / Piece US$2.00 / Piece US$2.00 / Piece US$0.68-2.27 / pieces
Min Order 1 Piece 1 Piece 2 Pieces 2 Pieces 5 pieces
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - Own Brand Own Brand Own Brand Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Tg: Tg130-Tg180;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Green;
Silk: White;
Surface Finish: HASL;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier