PCB Board

US$0.01-100.00 / Piece

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What is Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board

Name: Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board
Uploaded: 2026-08-22T17:29:00+08:00
Description: Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rog

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Made in China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-8.0mm
Hard Gold Thickness 1-50u''
Enig Thickness 1-3u''

Product Description

Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Board Comparison

	Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board Contact Now	Quick View Screen Driver PCB Control Board Touch Screen PCB Circuit Board Assembly Multi-Layer Board Manufacturing China Contact Now	Quick View High Standard Fr4 PCB Assembly for LED Driver PCB Board Contact Now	Quick View Wonderful PCBA Copy Clone PCB Reverse Engineering Printed Circuit Board Contact Now	Quick View LED Motion Sensor LED Lights PCB Assembly Daylight LED PCB PCBA Supplier Contact Now

Transaction Info
	Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board Contact Now	Quick View Screen Driver PCB Control Board Touch Screen PCB Circuit Board Assembly Multi-Layer Board Manufacturing China Contact Now	Quick View High Standard Fr4 PCB Assembly for LED Driver PCB Board Contact Now	Quick View Wonderful PCBA Copy Clone PCB Reverse Engineering Printed Circuit Board Contact Now	Quick View LED Motion Sensor LED Lights PCB Assembly Daylight LED PCB PCBA Supplier Contact Now
Price	US$0.01-100.00 / Piece	US$0.03-3.10 / Piece	US$0.35-2.10 / Piece	US$0.50-4.60 / Piece	US$0.05-3.33 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, PayPal	T/T, PayPal	T/T, PayPal	T/T, PayPal
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM	ODM	ODM	ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8.0mm; Hard Gold Thickness: 1-50u''; Enig Thickness: 1-3u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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What is Enig Immersion Gold PCB Customized Printed Circuit Board Multilayer HDI PCB Board

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