| Specification |
Type: Rigid Circuit Board;
Dielectric: Pi;
Material: Em825;
Application: Automotive Electronics, Security, Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 1oz;
Min Line Width/Space: 0.075mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 4;
Board Thickness: 0.1mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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