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PCB
US$1.00-100.00 / Piece
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What is Equipment Head Control Circuit Board PCBA Professional Manufature

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-100.00 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition Used
  • Transport Package Packed with ESD Protection in Carton
  • Specification Flexible base on drawing required
  • Trademark ZD
  • Origin Shenzhen, China
  • Functional Testing Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging
  • Type Rigid Circuit Board
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • BGA Minimum Dia 01015
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • Small Order Acceptable
  • IP Protection Strong Believe in IP Protection with Proven Record

Product Description

Company Profile HongKong Zhenda Group company is one stop integration solution provider, sub company focus on each professional field(Wire harness,PCB Assembly(SMT/DIP/AI), Sheet metal fabrication,self-service koisk) to do our best OEM ODM service for customer,welcome visit and audit factory! Good ...

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PCB Comparison
Transaction Info
Price US$1.00-100.00 / Piece US$1.05-5.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece
Min Order 1 Piece 10 Pieces 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification - ISO9001:2015 - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier