| Specification |
Structure: Double-Sided Rigid PCB;
Base Material: Fr4;
Brand: Dejia;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: White, Red, Green, Black;
Surface Treatment: Enig;
Outline Tolerance: +/-10%;
Testing: 100%;
Supply: Fast;
Service: One-Stop;
Mini Hole: 0.1mm;
MOQ: 1PCS;
Thickness Tolerance: +/-10%;
File: PCB File;
X-out: +/-5%;
Payment: T/T, D/P, L/C, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Based on Custom Made;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Surface Finishing: Enig;
Solder Mask: Any;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2, HB;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
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