| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: Fr4 and Polymide;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid and Flexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Ucreate;
Board Thickness: 1.6mm&0.2mm;
Base Material Type: Fr4+Pi;
Finished Copper Thickness 35um: 35/35um;
Surface Treatment: Immersion Gold;
Solder Mask Color: Green;
Lead Time: 9 Working Days;
Ipc Standards: Ipc Class II;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Layer Count: 8 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 2.0mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Red;
Specialities: BGA,Controlled Impedance;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Layer Count: 2 Layers;
Board Thickness: 1.6mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Matte Green;
Finished Copper Thickness: 35/35um;
Lead Time: 3-5 Working Days;
Ipc Standards: Ipc Class II;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: UC;
Board Layer: 1-24;
Board Thickness: 0.4-3.2 mm;
Soldermask Color: Green/White/Black/Blue/Red;
Surface Finish: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Lead Time: 5+ Working Days;
Fast Turn: 2+ Working Days;
Ipc Standards: Ipc Class II;
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