| Specification |
Structure: Single-Sided Rigid PCB;
Material: Aluminium;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Insulation Materials: Organic Resin;
Surface Technique: Hal, HASL, OSP;
Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm;
Thermal Conductivity: 1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K;
Sample Date: 3-5days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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