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Green Soldermask Multilayer Prototype Printed Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Square Meters US$60.00-75.00 / Square Meter

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Fr-4
  • Insulation Materials Organic Resin
  • Brand Kb
  • Transport Package Vacuum Packing
  • Specification UL ISO TS16949 IPC Standard
  • Trademark Zapon
  • Origin China
  • Surface OSP,Immersion Gold,Hal Lead Free,Hal
  • Solder Mask Green,Red,Yellow,White,Black,Blue,etc
  • Shipment Air,Sea,Express(DHL TNT FedEx EMS UPS)
  • Sample Date 3-5 Days
  • MOQ 10PCS
  • Delivery Time 15 Days

Product Description

Green soldermask Multilayer prototype printed circuitboard ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for ...

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PCB Board Comparison
Transaction Info
Price US$60.00-75.00 / Square Meter US$0.15-10.00 / Piece US$0.20-20.00 / Piece US$0.99 / PCS US$0.99 / PCS
Min Order 5 Square Meters 1 Piece 1 Piece 1 PCS 1 PCS
Payment Terms LC, T/T LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz/2oz;
Board Layer: 2/4/6 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Purple/Black/Red/Green;
Legend: White;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2/4/6 Layers;
Board Thickness: 1.6mm/Custom;
Surface Finish: Gold Plating, Enig;
Solder Mask: Purple/Black/Red/Green/Custom;
Legend: White;
Structure: Multilayer Rigid PCB;
Dielectric: RO4730g3 Laminate;
Material: Ceramic Filled PTFE Composites;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
Structure: Multilayer Rigid PCB;
Dielectric: F4btms300 Laminate;
Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
Supplier Name

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier