| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Icd Display;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1 Oz;
Surface Finishing: Hals/Lf-Hal;
Solder Mask Type: Black;
Board Thickness: 1.0mm;
Min. Hole Size: 0.25mm;
Min Line Width: 0.075mm;
Layer: 1 to 24;
Package: Vacuum;
Shipping: DHL, FedEx, UPS, Ect;
Tolerance: 0.05mm;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Surface Finishing: HASL,Immersion Gold;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.1mm;
Min. Line Spacing: 0.1mm;
PCB Silkscreen: White;
PCB Solder Mask: Green;
Pack: Vacuum Packing;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: Hal, HASL Lead Free, Immersion Gold, G;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min.Line Wigth: 0.2mm;
Min. Line Spacing: 0.2mm;
Layer: 1 to 24;
Solder Mask: Green,Blue,Ect;
Legend Mask: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: PTFE;
Insulation Materials: Epoxy Resin;
Surface Finishing: Immersion Gold;
Copper Thickness: 1oz;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 8mil;
Min. Line Spacing: 8mil;
Solder Mask Type: Yellow,Green;
Silkscreen: Yellow,Green;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Board Thickness: 1.6mm;
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