| Specification |
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 0-40;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Organic Resin;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Insulation Materials: Organic Resin;
The Capacity of Production: 50, 00sqm. /Month;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|