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Smart Induction Cooker PCB
US$0.01 / Piece
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What is Immersion Tin Rigid-Flex HDI PCB Board Smart Induction Cooker Quick Turn Fr4 PCBA New Energy Assembled Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

  • Metal Coating Enig / HASL / OSP / Silver etc.
  • Mode of Production SMT / DIP / PCB Manufacturing
  • Layers From 2 Layers to 50 Layers
  • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package UPS/DHL/TNT/EMS/FedEx
  • Specification Custom
  • Trademark OEM
  • Origin China
  • Quality Standard Ipc Class 2 / Class 3
  • Flame Retardant Properties 94V0
  • Layers Count 6 Layser
  • Mininum Trace Width 2.5 Mil
  • Max Copper Thickness 10 Oz

Product Description

Overview PCB Manufacturing Capabilies Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI laser drill ...

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Smart Induction Cooker PCB Comparison
Transaction Info
Price US$0.01 / Piece US$0.50-1.00 / Piece US$2.00-2.50 / Piece US$6.50-10.00 / Piece US$0.50-1.00 / Piece
Min Order 1 Piece 10 Pieces 500 Pieces 500 Pieces 10 Pieces
Payment Terms T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, CCC, ISO
Management System Certification - - ISO9001:2015 ISO9001:2015 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia North America
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM ODM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Board Thickness: Board Thickness;
Min. Hole Size: 0.15mm--0.25mm;
Min. Line Width: 0.063mm;
Min. Line Spacing: 0.063mm;
Surface Finishing: Lead Free Hal/Enig;
Layer: 1-24;
V-Cut Angle: 25 Degree,30degree,45 Degree,60degree;
Inner Packing: Vacuum Packing,ESD Packing;
out Packing: Standard Export Carton;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Board Thickness: Board Thickness;
Min. Hole Size: 0.15mm--0.25mm;
Min. Line Width: 0.063mm;
Min. Line Spacing: 0.063mm;
Surface Finishing: Lead Free Hal/Enig;
Layer: 1-24;
V-Cut Angle: 25 Degree,30degree,45 Degree,60degree;
Inner Packing: Vacuum Packing,ESD Packing;
out Packing: Standard Export Carton;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Supplier Name

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier

Dongguan Access Star Co., Ltd.

Gold Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier