| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Color: Black;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V1;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
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Structure: Single-Sided Rigid PCB;
Dielectric: CEM-3;
Material: Epoxy Fiber Galss;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: White, Transparent;
Market: Euro, Asia, Central and South America;
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Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Comformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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