| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Ucreate PCB;
Copper Thickness: 2oz;
Surface Finishing: Immersion Gold PCB;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Certificates: UL, ISO, RoHS, Ts;
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Type: Rigid Circuit Board;
Dielectric: Rogers Tmm6;
Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Rogers Tmm6;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 50mil;
Layer Count: Double Layer;
Application: Stripline and Microstrip;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: Taconic Tly-3;
Material: Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Taconic Tly-3;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 30mil;
Layer Count: 2-Layer;
Application: Radar and Antenna;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: Rogers Tmm10;
Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Rogers Tmm10;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 30mil;
Layer Count: 2-Layer;
Application: Stripline and Microstrip;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: Rogers Tmm10I;
Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Rogers Tmm10I;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 15mil 25mil 50mil 75mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Stripline and Microstrip;
Surface Finish: HASL, Enig, Immersion Tin, Immersion Silver, OSP;
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