| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|