What is OEM Smart Glass Circuit Assembly with Bendable Design
Price
Purchase Qty. Reference FOB Price
5-499 Pieces US$1.00
500-999 Pieces US$0.80
1,000-9,999 Pieces US$0.70
10,000+ Pieces US$0.60
Sepcifications
- Layers 1-16 Layers
- Base Material Pi + Fr-4
- Certification IATF16949/ISO9001:2015/ISO13485/QC08000/ISO45001/
- Customized Customized
- Condition New
- Transport Package Anti-Static Bubble Wrap ESD-Safe Blister Tray
- Specification 41*40.5*30.5
- Trademark TDT-ELE
- Origin Guangdong, China
- Maximum Dimensions Regular: 234 × 490 mm
- Minimum Dimensions No Limit
- Surface Finish Enig. Thickness: 1u" / 2u
- FPC Thickness Tolerance ±0.05 mm
- Hole Diameter 0.15-6.5 mm
- Coverlay Color Yellow / Black / White
- Pi Stiffener 0.1 mm, 0.15 mm, 0.20 mm, 0.225 mm, 0.25 mm
- Fr4 Stiffener Thickness Options: 0.1 mm, 0.2 mm
Product Description
Product Description RIGID-FLEX PCBA: PREMIUM HYBRID CIRCUIT BOARD ASSEMBLY FOR HIGH-PERFORMANCE ELECTRONICS Looking for a Rigid-Flex PCBA solution that combines reliability, space efficiency, and superior signal integrity? Our Rigid-Flex PCB Assembly integrates FR-4 rigid sections with ultra-thin ...
