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High Quality PCBA
US$0.60-1.00 / Piece
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What is Top-Quality Rigid PCBA for Smartphones with Dual Layers

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-499 Pieces US$1.00

500-999 Pieces US$0.80

1,000-9,999 Pieces US$0.70

10,000+ Pieces US$0.60

Sepcifications

  • Mode of Production SMT & Thd
  • Layers 1-32 Layers
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bubble Wrap ESD-Safe Blister Tray
  • Specification 41*40.5*30.5
  • Trademark Tdt-Ele
  • Origin Guangdong, China
  • Controlled Impedance 4/6/8/10/12/14/16/18/20/.../32 Layers
  • Impedance Tolerance ±10%
  • Material Fr-4 / Aluminum-Core /Copper-Core /RF PCB
  • Fr-4 Dielectric Constants 4.5 (2-Layer PCB)
  • Dimension Tolerance ±0.1mm
  • Thickness 0.4-4.5 mm
  • Thickness Tolerance ± 10% (Thickness≥1.0mm)
  • Finished Inner Layer Copper 0.5 Oz / 1 Oz / 2 Oz
  • Soldermask Green, Purple, Red, Yellow, Blue, White, and Black
  • Surface Finish HASL (Leaded / Lead-Free), Enig, OSP

Product Description

Product Description PREMIUM RIGID PCB ASSEMBLY SERVICES | HIGH-QUALITY PCBA MANUFACTURING Looking for reliable rigid PCB assembly solutions? Our professional PCBA manufacturing services deliver exceptional quality from prototype to high-volume production. We specialize in multilayer PCB assembly ...

Learn More

High Quality PCBA Comparison
Transaction Info
Price US$0.60-1.00 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification RoHS, ISO RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification ISO9001:2015, ISO45001:2018, Others - - - -
Trade Capacity
Export Markets Europe, Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Mode of Production: SMT & Thd;
Layers: 1-32 Layers;
Customized: Customized;
Condition: New;
Controlled Impedance: 4/6/8/10/12/14/16/18/20/.../32 Layers;
Impedance Tolerance: ±10%;
Material: Fr-4 / Aluminum-Core /Copper-Core /RF PCB;
Fr-4 Dielectric Constants: 4.5 (2-Layer PCB);
Dimension Tolerance: ±0.1mm;
Thickness: 0.4-4.5 mm;
Thickness Tolerance: ± 10% (Thickness≥1.0mm);
Finished Inner Layer Copper: 0.5 Oz / 1 Oz / 2 Oz;
Soldermask: Green, Purple, Red, Yellow, Blue, White, and Black;
Surface Finish: HASL (Leaded / Lead-Free), Enig, OSP;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Shenzhen Tianditong Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier