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Jetson
US$1,370.00-1,400.00 / Piece
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What is Nvidia Jetson Agx Orin Module 32GB 64GB Developer Kit Industrial Ai Embedded Development Board Computer Carrier Board Case Module

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$1,400.00

10+ Pieces US$1,370.00

Sepcifications

  • Processor Type ARM
  • Stratification HardWare Layer
  • Range of Application Dedicated
  • Bus Type Not Bus Type
  • Type Embedded Board
  • Transport Package Custom
  • Specification Official
  • Trademark Nvidia
  • Category Module/Developer Kit
  • Series Jetson
  • Description Ai Development
  • Feature Smart Chip
  • Sdk Jetpack
  • Condition New
  • Warranty 1 Year

Product Description

Product . Jetson AGX Orin series Jetson AGX Orin Developer Kit Jetson AGX Orin 64GB Jetson AGX Orin Industrial Jetson AGX Orin 32GB AI Performance 275 TOPS 248 TOPS 200 TOPS GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores 1792-core NVIDIA Ampere architecture GPU with ...

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Jetson Comparison
Transaction Info
Price US$1,370.00-1,400.00 / Piece US$28.00-50.00 / Piece US$117.00-156.00 / Piece US$121.00-160.00 / Piece US$85.00-112.00 / Piece
Min Order 1 Piece 2 Pieces 2 Pieces 2 Pieces 2 Pieces
Payment Terms T/T, D/P, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
Management System Certification - - - - -
Trade Capacity
Export Markets Eastern Europe, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: Dedicated;
Bus Type: Not Bus Type;
Type: Embedded Board;
Category: Module/Developer Kit;
Series: Jetson;
Description: Ai Development;
Feature: Smart Chip;
Sdk: Jetpack;
Condition: New;
Warranty: 1 Year;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Name: Rk3566 Som;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Supplier Name

Telefly Telecommunications Equipment Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier