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Rockchip Rk3562 IoT Soc Module
US$28.00-41.00 / Piece
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What is Rockchip Rk3562 Aiot Soc Module Octa Core Development Board Android Motherboard

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

2-499 Pieces US$41.00

500-999 Pieces US$35.00

1,000-2,999 Pieces US$32.00

3,000-9,999 Pieces US$30.00

10,000+ Pieces US$28.00

Sepcifications

  • Application Field Aiot
  • Processor Type ARM
  • Range of Application General
  • Certification CE, RoHS, FCC
  • Type Embedded SBC
  • Transport Package Giftbox
  • Specification 20x15x10 cm
  • Trademark ODM
  • Origin Shenzhen, Guangdong, China
  • CPU 4×cortex-A53, 2.0GHz
  • Process 22nm
  • GPU Arm G52 2ee
  • Npu 1.0 Tops Ai Acceleration
  • OS Android 13
  • RAM Lpddr4 2GB
  • Storage Emmc 32GB/64GB
  • Video Decode 4K@30fps H.265/Vp9/AV1
  • Video Encode 1080P@60fps H.265/H.264
  • Display Outputs Mipi, Edp up to 2048×1080
  • Network Gigabit Ethernet, Poe Ready, WiFi6, Bluetooth 5.2
  • USB Ports Type-C OTG, 1×USB3.0, 2×USB2.0
  • Audio 3W×2 Amplifier, 3.5mm Jack, Mic Input
  • Operating Temp -20°c ~ +70°c
  • Board Size 83.8×84mm, 4-Layer PCB

Product Description

Product Overview Rockchip RK3562 SBC AI Edge Computing Development Board Model: M3562 The RK3562 Embedded AI Computing Board combines efficient quad-core processing, 1 TOPS neural network acceleration, and advanced multimedia decoding in a compact form factor. Designed for digital signage, IoT ...

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Rockchip Rk3562 IoT Soc Module Comparison
Transaction Info
Price US$28.00-41.00 / Piece US$295.00 / Piece US$175.00 / Piece US$175.00 / Piece US$175.00 / Piece
Min Order 2 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
Quality Control
Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
Management System Certification - - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Application Field: Aiot;
Processor Type: ARM;
Range of Application: General;
Type: Embedded SBC;
CPU: 4×cortex-A53, 2.0GHz;
Process: 22nm;
GPU: Arm G52 2ee;
Npu: 1.0 Tops Ai Acceleration;
OS: Android 13;
RAM: Lpddr4 2GB;
Storage: Emmc 32GB/64GB;
Video Decode: 4K@30fps H.265/Vp9/AV1;
Video Encode: 1080P@60fps H.265/H.264;
Display Outputs: Mipi, Edp up to 2048×1080;
Network: Gigabit Ethernet, Poe Ready, WiFi6, Bluetooth 5.2;
USB Ports: Type-C OTG, 1×USB3.0, 2×USB2.0;
Audio: 3W×2 Amplifier, 3.5mm Jack, Mic Input;
Operating Temp: -20°c ~ +70°c;
Board Size: 83.8×84mm, 4-Layer PCB;
Application Field: Industrial Control;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: Dedicated;
Type: Embedded Systems;
CPU: Intel Alder Lake I5-12450h;
CPU Frequency: Max Speed: 4.4GHz;
CPU Power Consumption: 45wh (Can Limite to 28wh);
Material: Fully Aluminium Case for Heat Dissipation;
RAM: Lpddr4X 16g;
ROM: 512g SSD;
Video out: HDMI Ouput X2;
Ethernet: 1000Mbps;
OS: Windows;
Heat Dissipation: Build-in Fan for Heat Dissipation;
Application Field: Industrial Control;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: Dedicated;
Type: Embedded Systems;
CPU: Intel N100;
CPU Frequency: Max Turbo Frequency Is 3.4GHz;
CPU Performance: 4 Cores and 4 Threads;
Material: Fully Aluminium Case for Heat Dissipation;
RAM: Lpddr4X 16g;
ROM: 512g SSD;
Video out: HDMI Ouput X3;
Ethernet: Dual G-LAN 1000mbpsx2;
OS: Windows;
Heat Dissipation: Build-in Fan for Heat Dissipation;
Application Field: Industrial Control;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: Dedicated;
Type: Embedded Systems;
CPU: Intel N100;
CPU Frequency: Max Turbo Frequency Is 3.4GHz;
CPU Performance: 4 Cores and 4 Threads;
Material: Fully Aluminium Case for Heat Dissipation;
RAM: Lpddr4X 16g;
ROM: 512g SSD;
Video out: HDMI Ouput X3;
Ethernet: Dual G-LAN 1000mbpsx2;
OS: Windows;
Heat Dissipation: Build-in Fan for Heat Dissipation;
Application Field: Industrial Control;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: Dedicated;
Type: Embedded Systems;
CPU: Intel N100;
CPU Frequency: Max Turbo Frequency Is 3.4GHz;
CPU Performance: 4 Cores and 4 Threads;
Material: Fully Aluminium Case for Heat Dissipation;
RAM: Lpddr4X 16g;
ROM: 512g SSD;
Video out: HDMI Ouput X3;
Ethernet: Dual G-LAN 1000mbpsx2;
OS: Windows;
Heat Dissipation: Build-in Fan for Heat Dissipation;
Supplier Name

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Mekotronics Co., Ltd.

Diamond Member Audited Supplier

Mekotronics Co., Ltd.

Diamond Member Audited Supplier

Mekotronics Co., Ltd.

Diamond Member Audited Supplier

Mekotronics Co., Ltd.

Diamond Member Audited Supplier