| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Etching;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt;
Size: Customizable;
Thickness: 0.08-0.32mm;
Tensile Strength: ≥200 MPa;
Working Temp.: -269℃~+250℃;
Feature: Chemical Resistance;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Beauty Mask FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Assembly Type: FPC, Rigid-Flex PCB;
HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm;
Through-Hole Tolerance: ± 0.05 mm;
Etching Tolerance: ± 0.02 mm;
Solder Accuracy Tolerances: ± 0.05 mm;
|
