| Specification |
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Flexible;
Usage: Playback Switch, Disconnector, Change-Over Switch, Control Switch;
Number of Switch: Multi Control Switch;
Contact Type: FPC Terminal Connector;
Detection Method: Circuit Function Testing Equipment;
Brand: Snt;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Surface Finishing : HASL, Immersion Gold, OSP;
Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
Laser Drilling Hole Size: 4mil(0.1mm);
Drilling Bit Size CNC): 6mil-256mil;
Boardness: +/-10%;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Surface Finishing : HASL, Immersion Gold, OSP;
Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
Laser Drilling Hole Size: 4mil(0.1mm);
Drilling Bit Size CNC): 6mil-256mil;
Boardness: +/-10%;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Surface Finishing : HASL, Immersion Gold, OSP;
Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
Laser Drilling Hole Size: 4mil(0.1mm);
Drilling Bit Size CNC): 6mil-256mil;
Boardness: +/-10%;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Surface Finishing : HASL, Immersion Gold, OSP;
Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
Laser Drilling Hole Size: 4mil(0.1mm);
Drilling Bit Size CNC): 6mil-256mil;
Boardness: +/-10%;
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