| Specification |
Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thickness: 0.2-6.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lead Free;
Copper Thickness: 18um-3500um(0.5- 100oz);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
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