| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Color: Green, Yellow, Black, White, Red, Blue;
Copper Thickness: 0.5oz, 1.0oz, 2oz, 3oz;
Min Solder Resist Bridge: 0.1mm;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Aluminum Board;
Customized: Customized;
Condition: New;
Copper Thickness: 1-6oz;
Thermal Conductivity: 0.8-3W/M.K;
Board Thickness: 0.3-5mm;
Color Temparature: 2600-9000K;
CRI: >=80;
Brightness Grade: >60 Lm;
LED Type: 3528/2835/5050/3014/5730/3030;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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