| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 Tg;
Customized: Customized;
Condition: New;
Copper Thickness: 10z;
Min Solder Resist Bridge: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Board Thickness: 0.2-4.0mm;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Cast Iron (Surface Spray Paint Treatment);
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Application: Electrical & Electronics Industry, Lighting Indust;
Tin Furnace Material: Cast Iron;
Mode of Transport: Negotiable with Suppliers;
Warranty: 1 Year;
After-Sales Service: Online/Go to Client;
Customizable: Conditional Customization;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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