| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4 Tg;
Customized: Customized;
Condition: New;
Copper Thickness: 10z;
Min Solder Resist Bridge: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Board Thickness: 0.2-4.0mm;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Size: 5*5mm to 500*600mm;
Application: Consumer Electronics;
Surface Finish: Lead/Lead-Free HASL/Lmmersion Gold/Customize;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Size: 5*5mm to 500*600mm;
Application: Consumer Electronics;
Surface Finish: Lead/Lead-Free HASL/Lmmersion Gold/Customize;
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Metal Coating: 1;
Mode of Production: 1;
Layers: 1;
Base Material: 1;
Customized: 1;
Condition: 1;
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Metal Coating: 1;
Mode of Production: 1;
Layers: 1;
Base Material: 1;
Customized: 1;
Condition: 1;
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