| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Plcopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Copper Thickness: 0.5oz;
Selling Units: Single Item;
Min.Hole Size: 0.15mm;
Packaging Details: Standard Package;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Item: Multilaver Flexible Printed Circuit Board;
Type: FPC;
Board Size: Custom;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, LED Soft Screen FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, LCD FPC Cable;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, LED Strip FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, LED Strip FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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