| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4+Pi;
Insulation Materials: Epoxy Resin;
PCB+Flex-PCB: 218mm*150mm;
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Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm / 0.03mm 1.2mil / 1.2mil;
Coverlay Color: Amber (Yellow), Black, White, Customized;
Back Adhesive: 3m 467MP / 9448A High Temp. Resistant & High Bond;
Stiffener Material: Pi / Fr4 / Stainless Steel (SUS);
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm / 0.03mm 1.2mil / 1.2mil;
Coverlay Color: Amber (Yellow), Black, White, Customized;
Back Adhesive: 3m 467MP / 9448A High Temp. Resistant & High Bond;
Stiffener Material: Pi / Fr4 / Stainless Steel (SUS);
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm / 0.03mm 1.2mil / 1.2mil;
Coverlay Color: Amber (Yellow), Black, White, Customized;
Back Adhesive: 3m 467MP / 9448A High Temp. Resistant & High Bond;
Stiffener Material: Pi / Fr4 / Stainless Steel (SUS);
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm / 0.03mm 1.2mil / 1.2mil;
Coverlay Color: Amber (Yellow), Black, White, Customized;
Back Adhesive: 3m 467MP / 9448A High Temp. Resistant & High Bond;
Stiffener Material: Pi / Fr4 / Stainless Steel (SUS);
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