| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Customized;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Surface Mounted Technolgoy;
Application: Industry Equipment;
Mechanical Rigid: Fexible;
Material: The Paper Ring Gas Resin;
Brand: Jxpcba;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Okey PCBA;
Customized: Customizable;
Board Material: Fr4, H-Tg, It-180A, Cem;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP;
Conditions: New;
Testing: Fly Probe Test Visual Checking;;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots;
Service: Turnkey PCB Assembly Service;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: FR-5;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: The Paper Ring Gas Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: FR-5;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: The Paper Ring Gas Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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