| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Customized;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 0.2-4.0mm;
Copper Thickness: 1oz to 5 Oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.15mm;
Min Line Spacing: 0.15mm;
Layer: 1 to 18;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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