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Flexible PCB Assembly
US$5.00-500.00 / Piece
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What is Custom Foldable Circuit Board Assembly for Innovative Folding Smartphones

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$5.00-500.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties HB
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Customized
  • Transport Package ESD Bag, Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Product Name High Complexity PCBA
  • Service PCB+Assembly+Components
  • Testing Service Electrical Testing, Flying Probe Tester, Functiona
  • Value-Added Services Bom Analysis, Conformal Coating, IC Programming
  • Technical Support Free Dfm/a Check, Bom Analysis
  • Placement Precision ±0.03mm / ±0.01mm (Chip)

Product Description

Workshop Introduction Product Description High Complexity PCB Assembly PCBA Specification Turnkey Service PCB Design + PCB FAB + Component Sourcing + PCBA + Box Building + Packaging Value-Added Services BOM Analysis, Conformal Coating, IC Programming, Wire Harness &Cable Assembly, Ageing &Testing ...

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Flexible PCB Assembly Comparison
Transaction Info
Price US$5.00-500.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms - - - - -
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Supplier Name

Primustron Electronics

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier