| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
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Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finish: Enig;
Overal Board Thickness: 2.0mm;
Min Hole: 0.1mm;
Board Thickness: 1.2mm;
Min Line Width/Space: 0.1/0.1mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 1-24layers;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Copper Thickness: 1oz or Custom;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Board Thickness: 0.2-4mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Mounting Component Pitch: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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