| Specification |
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: The Paper Ring Gas Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum Base Board;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Light;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Abis;
Layer: 1 Layer;
Board Thickness: 1.0;
Thermal Conductivity: 1.0W;
PCBA Type: SMT/DIP;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ;
Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm;
Thermal Conductivity: 1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K;
Ccl Brand: Jh, Ccaf.etc;
Sample Date: 3-5days;
|
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Abis;
Al PCB Layer: 1-2 Layer;
Max.Board Size: 1200mm*560mm;
Surface Finished: Lf-HASL, Enig, Immersion, OSP etc;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Solder Mask: Black;
Legend: White;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Lighting;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Abis;
Layer: 1 Layer;
Solder Mask: White;
Surface Finish: HASL-Lf;
Legend Color: Yellow;
Board Thickness: 1.6mm;
|