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FPC
US$0.01-0.35 / Piece
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What is 1-16 Layers High Quality Flex PCB Board/FPC Board/Rigid-Flex Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.35 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Okey
  • Transport Package Inner Vacuum Packing Outer Carton Box
  • Specification FR4 PI, 0.1-0.3mm, 1 Layer, 1OZ Copper Thickness
  • Trademark OKEY/ODM OEM
  • Origin China
  • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
  • Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
  • Layer 1-6 Layers
  • Service Turnkey Assembly PCB Service
  • Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
  • Min Hole Size Mechanical Hole: 0.15mm, Laser Hole: 0.1mm
  • Outline Profile Rout/ V-Cut/ Bridge/ Stamp Hole
  • Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
  • Order Qty No Limited
  • Controlling Range -40c~125c
  • Solder Resist Color Green;Red;Yellow;Black;White
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
  • Trade Mark OEM, ODM
  • Min. Line Width 2mil
  • Max Production Size 600*800mm

Product Description

Okey provides one-stop service for you: 1. PCB development and design; 2. PCB manufacturing from 1 to 48 layers(Rigid PCB,Flexible PCB,Ceramci PCB,Aluminum PCB); 3. PCB Clone; 4. Component sourcing; 5. PCB Assembly; 6. Write program for customers; 7. PCB/ PCBA Test. 8. Contract Manufacturing ...

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FPC Comparison
Transaction Info
Price US$0.01-0.35 / Piece US$1.00 / Piece US$0.68-2.27 / pieces US$0.68-2.27 / pieces US$1.00 / Piece
Min Order 1 Piece 1 Piece 5 pieces 5 pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Product Certification ISO9001, ISO14000, Ts16949.UL.RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model - Own Brand Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-6 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 2mil;
Max Production Size: 600*800mm;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Supplier Name

Shenzhen Okey Circuit Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier