| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4730g3 Laminate;
Material: Ceramic Filled PTFE Composites;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: F4btms300 Laminate;
Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: Fr4;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr-4 (Main), Aluminum Substrate (Optional for Heat;
Layers: 4 to 45layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Processing Technic: SMT (Surface Mount Technology) /DIP (Through-Hole);
Supplier: Manufacturer;
Test Technic: Aoi/ X-ray;
Service: Fast-Prototype/Mass Production;
After-Sales Service Cycle: 12 Months;
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Structure: Multilayer Rigid PCB;
Dielectric: Ceramics;
Material: Ceramics;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Customized;
Model No.: Multilayers Ceramic PCB;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Layers: 1-4 Layers;
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