| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey PCBA;
Application: Electronic Products;
Customized: Customizable;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Lead Time: 6-8 Workdays;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base, Teflon;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
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Type: Flame Retardant 4 PCBA;
Dielectric: FR-4;
Material: Flame Retardant;
Flame Retardant Properties: UL94 V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: AC42228-Sh001-B1 Smart PCBA Module;
Brand: Weforsemi;
Testing Service: Electrical Testing,Flying Probe Tester,Functiona;
Condition: New;
Custom Condition: Support;
Function1: Digital Tube Display, LED Display, Button Control,;
Function2: MCU Power Supply, Buzzer and Relay;
Type1: Power Board;
Type2: Control Board;
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Type: Flame Retardant 4 PCBA;
Dielectric: FR-4;
Material: Flame Retardant;
Flame Retardant Properties: UL94 V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: Vc100ga-V1.0 M3 Module PCBA;
Brand: Weforsemi;
Testing Service: Electrical Testing,Flying Probe Tester,Functiona;
Condition: New;
Custom Condition: Support;
PA2: Burningio Mouth;
Vcc: Power Input 2-*5.5V;
Standby Operating Current: 13-15mA;
Warranty: 12 Months;
Shipping: Air or Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: OEM;
Copper Thickness: 0.5-12 Oz, Customized;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Application Industries: Communications, Industrial Control, Semiconductors;
Board Thickness: 0.2-6.0 mm, Customized;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB etc;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
MOQ: No MOQ;
E-Test Coverage: 100% Electrical Test, Partial Test;
Aoi Inspection: 100% Aoi, Spot Check;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
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