| Specification |
Type: Solderless Breadboard;
Customized: Customized;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Type: Fr4;
Customized: Customized;
Product Name: PCBA PCB Assembly;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Testing Methods: Aoi Ict X-ray Functional Testaoi Ict X-ray Functio;
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Type: Fr4;
Customized: Non-Customized;
Product Name: PCBA PCB Assembly;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Esting Methods: Aoi Ict X-ray Functional Test;
|
Type: Fr4;
Customized: Customized;
Product Name: PCBA PCB Assembly;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Testing Methods: Aoi Ict X-ray Functional Test;
|
Type: Fr4;
Customized: Customized;
Product Name: PCBA PCB Assembly;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Testing Methods: Aoi Ict X-ray Functional Test;
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