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Circuit Board
US$8.50-15.00 / Piece
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What is High Density Interconnect Multilayer PCB HDI PCBA Circuit Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-999 Pieces US$15.00

1,000-9,999 Pieces US$10.00

10,000+ Pieces US$8.50

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO, ISO13485 & IATF16949
  • Customized Customized
  • Condition Used
  • Transport Package Individual Bubble Bag and Carton
  • Specification custumized
  • Trademark Grandtop
  • Origin China
  • MOQ No Required
  • Delivery Term 7-15days
  • Shipment Air,Sea,Express(DHL TNT FedEx EMS UPS)
  • Processing Technology Electrolytic Foil
  • Flame Retardant Properties V0
  • Material Polyester Glass Fiber Mat Laminate
  • Insulation Materials Epoxy Resin
  • Surface Treatment Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
  • Certificate UL(Us&Canada). ISO9001. RoHS, Ts, SGS

Product Description

To provide you with Professional and High Quality PCBA products and Service Founded In:2005 Specilized In: SMT, DIP, MI, AI, PCB assembling, conformal coating, final product assembling, testing, material procurement ,and one stop services such as wire harness, sheet metal , plastic ...

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Circuit Board Comparison
Transaction Info
Price US$8.50-15.00 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 100 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification UL(Us&Canada). ISO9001. RoHS, Ts, SGS RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
MOQ: No Required;
Delivery Term: 7-15days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Processing Technology: Electrolytic Foil;
Flame Retardant Properties: V0;
Material: Polyester Glass Fiber Mat Laminate;
Insulation Materials: Epoxy Resin;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier