| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Applications: Electronic Manufacturing Service;
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Metal Coating: According to Customer Needs;
Mode of Production: SMT, DIP, Tht;
Layers: Single-Layer, Double-Layer, Multilayer;
Base Material: According to Customer Needs;
Customized: Customized;
Condition: New;
Layer Counts: 2-50 Layers;
Components Size: SMT 01005 to 100mmx80mm;
Minimum Width/Space of Qfp: 0.15mm/0.3mm;
Minimum Diameter /Space of BGA: 0.2mm/0.35mm;
Maximum Part's High: 18mm;
Maximum Part Weight: 30g;
PCB Size: 50mmx 50mm~450mmx 406mm;
PCB Thickness: 0.5mm~4. 5mm;
Placer Speed: 8, 0000 Chips/Hour;
Feeders Number: 140 Piece of 8 mm Reel Feeders;
PCB Material: Fr4, Halogen Free Material, Cem-3, etc;
Solder Mask Color: Green, Red, Black, Blue, White, Yellow, Matt, etc.;
Service: One-Stop Service;
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Metal Coating: Tin;
Mode of Production: DIP;
Layers: Double-Layer;
Customized: Customized;
Condition: New;
Whole Machine: OEM/ODM;
Variation Frequency: 47~63Hz;
Input Frequency: 50~60Hz;
AC Output Voltage: AC 300~700V;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
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